Testing & Inspection
Electrical Testing

> Continuity Testing 

Verifies all electrical paths are complete and correctly routed.

> Insulation Resistance & Hi-Pot Testing 
Ensures insulation integrity and dielectric strength.
> Impedance & Signal Integrity Testing 
Validates performance for high-speed and RF applications.
Functional Testing (FCT)
> Custom Test Fixtures
 Designed in-house to simulate real-world operating conditions.
> Firmware & I/O Validation
 Ensures embedded systems function as intended.
Visual & Automated Optical Inspection (AOI)
> AOI Systems
 Detect solder defects, polarity issues, and misalignments.
> Manual Inspection
 Performed by IPC-certified technicians for final verification.
X-Ray Inspection
> BGA & LGA Analysis
Non-destructive imaging of hidden solder joints.
> Void & Cold Joint Detection
 Ensures solder quality in critical areas.
Solder Paste Inspection (SPI)
> 3D SPI Systems
Measure solder paste volume, height, area, and alignment before component placement.
> Defect Prevention
Identifies insufficient, excessive, or misaligned paste deposits early in the process.
> Closed-Loop Feedback
SPI data is used to adjust stencil printing in real time, improving first-pass yield.
Documentation & Traceability
> Test Reports & Logs
Detailed records of all inspections and test results.
> Serial Number Tracking
Full traceability from raw materials to final product.
> Compliance Records
 Maintained for ISO, IPC, UL, and customer-specific standards.