Surface Mount Technology (SMT) Assembly

Capabilities Overview

Single- and Double-Sided SMT Assembly

Placement of components on one or both sides of the PCB using automated pick-and-place machines and reflow soldering.

Mixed Technology Assembly


Integration of SMT and through-hole components on the same board, including selective soldering and hand soldering.

Micro Component Placement


Capable of placing ultra-small components (01005, 0201) with high-speed precision.


Complex Package Handling

Support for BGAs, QFNs, LGAs, CSPs, and PoP assemblies with X-ray verification.

Lead-Free and Leaded Processes

Separate lines for RoHS-compliant and traditional tin-lead soldering to prevent cross-contamination.

Flexible Volume Production

From quick-turn prototypes to high-volume production runs with scalable line configurations.
Inspection and Quality Control
Solder Paste Inspection (SPI)
3D inspection of solder paste deposits for volume, height, and alignment before component placement.
Automated Optical Inspection (AOI)
High-resolution cameras detect solder defects, polarity issues, and component misalignment.
X-Ray Inspection
Non-destructive imaging for hidden joints (e.g., BGAs, LGAs) to detect voids, bridging, and cold solder joints.
In-Circuit Testing (ICT)
Electrical testing of individual components and nets using bed-of-nails or flying probe systems.
Functional Testing (FCT)
Simulates real-world operating conditions to verify board functionality, firmware, and I/O behavior.
Environmental Testing (optional)
Thermal cycling, vibration, humidity, and salt fog testing for ruggedized applications.
npm2
 

Feature

Specification

Top Speed

Up to 77,000 CPH using 16‑nozzle head

Placement Accuracy

±25 µm (chips), ±40 µm general

Component Size Support

From 03015 mm to 150 × 25 × 30 mm

PCB Support

Up to 750 × 550 mm (single lane); dual‑lane up to 750 × 510 mm

Inspection & Dispensing

Integrated SPI/AOI, non‑contact adhesive

Feeder Capacity

Up to 120 tape feeders

Special Features

Multi‑Recognition Camera, modular head/feeder system

AIO-1
 
Feature
Specification
Scan Speed
~65 cm²/sec at 14 µm (~10 s per board 260×200 mm)
Camera & Lighting
4 MP CMOS, dual‑laser, RGBW + telecentric lens
Height Accuracy / Repeatability
±3 µm up to 3 mm; ~6 µm above
Defect Types
Full range: solder, component alignment, OCR/OCV text, tombstone, bridging, warpage, foreign material
Barcode Recognition
1D/2D/QR + bad mark scanning
Model Variants
Xceed (various sizes), Xceed II, Xceed II MP
Advanced Sensor
TRSC‑II sensor in Xceed II: 4–14 µm selectable resolution
Multi‑Process Support
SPI + AOI + CCI unified in Xceed II MP
System Integration
SECS/GEM, TCP/IP, MES/ERP, web/mobile monitoring
SPI-1
 
Feature
Specification
Inspection Speed
Orange: 100 cm²/sec; Blue: 60 cm²/sec (10×10 µm)
Transport Speed
Up to 1,000 mm/sec
Height Accuracy / Repeatability
~2 µm / <1 µm (3σ)
Warpage Compensation
±5 mm tracked in real time
Defect & Measurement Types
Height, area, volume, offset, bridges, warpage, shrink, etc.
PCB Compatibility
All board colors, finishes, reflective materials
Software Analytics
SPC, process feedback, root-cause analysis
Ease of Programming
Gerber/CAD/BOM import, auto-generated ROIs
Model Variants
Sigma X, X Dual/Duo, XL, XXL, XXXL
Max Panel Size
Up to ~1,200 × 450 mm depending on model
X-RAY
 
Feature
Specification
Feature resolution
Down to 0.35 µm at 10 W (0.95 µm at 20 W)
Detector & Magnification
AspireFP™ 3 MP @25 fps; up to 45,000×
Active stabilization
AXiS anti-vibration technology
Inspection routines
BGA/QFN voids, wire sweep, pad, bump
3D Options
X‑Plane® virtual slicing; µ‑CT available
PCB sample size
Up to ~510 × 445 mm (tray); board size ~740 × 580 mm
Platform software
Gensys control software, 24″ WUXGA display
SOLDER
 
Feature
Specification / Capability
Models Available
HPS5/55 (single-mode), HPS5/55 Dual-mode
Dimensions
~4,200 × 1,915 × 1,571 mm
PCB Size Capacity
Up to ~510 × 510 mm
Transport Width
Adjustable 50–510 mm
Conveyor Height
900 ± 20 mm
Solder Pot Design
Electromagnetic pump
N₂ Usage
~1.5–2 m³/h per pot
Module Options
1, 2, or 3 solder modules
WAVE SOLDER
 
Feature
Specification / Benefit
Process Width
Up to ~508 mm (20")
Preheat
Bottom up to 1.8 m; Top up to 1.2 m
Solder Pot
Cast iron with lifetime warranty
Solder Nozzles
UltraFill 4.0, DwellMax/Flex 4.0
Flux System
ServoJet / Spray / Sonic; dual-flux
Flux Flow Monitoring
Non-contact, board-by-board monitoring
Automatic Wave Height
ExactaWave with closed-loop control
Wave Dynamics Control
Auto Exit Wing for flow adaptation
Traceability
Data and SPC logging, barcode integration
Nitrogen Option
Full or short tunnel for <50 ppm O₂ environments
REFLOW
 
Benefit
Description
Superior thermal uniformity
Ensures consistent solder profiles and minimizes defects
Low maintenance & long life
Easy filter access and preventive flux capture
Efficient energy use
Idle-saving features cut power use and reduce operational cost
Lead‑free ready
Built to support lead‑free soldering, with tight process control
CONFORMAL COATING
 
Feature
Highlights
Repeatability
±25 µm with 5 µm resolution
Motion Control
3-axis gantry + optional 4-axis tilt/rotate
Software
PathMaster® (offline programming, image import)
Work Area
~521 × 485 × 100 mm
Throughput Speed
~670 mm/s dispense, conveyor up to 24.4 m/min
Applications
Conformal coating, potting, underfill, etc.
Process Control and Traceability
Reflow Profiling:

MES Integration:

ESD-Safe Environment:

Each board type receives a custom thermal profile to ensure optimal solder joint formation.
Our Manufacturing Execution System tracks every board through production, linking serial numbers to lot codes, operators, and     inspection results.
All SMT operations are conducted in ESD-controlled areas to protect sensitive components.
Engineering Support
Design for Manufacturability (DFM)
Reviews to optimize PCB layout, component selection, and assembly processes.
Design for Testability (DFT)
Recommendations for test point placement and test strategy development.
Rapid Prototyping & NPI
Fast-turn builds with engineering feedback to accelerate product development cycles.
Stencil Design & Optimization
Custom stencil creation for precise solder paste application and consistent reflow results.
Component Engineering
Reviews to optimize PCB layout, component selection, and assembly processes.
Production Flexibility
Low to High Volume:
Quick Turnaround:
Whether you need 10 boards or 100,000, our flexible lines and scalable processes adapt to your production needs.
We offer expedited services for urgent builds without compromising quality.
Industries Served
Automotive & EV
Medical Devices
Industrial Automation
Telecommunications
Consumer Electronics
Aerospace & Defense